Produktbeschreibung
CHIPLED 0805, super-red, colorless diffused
Product Features
Package: SMT package 0805 colorless diffused resin 2 mm x 1.25 mm x 0.8 mm
Feature of the device: extremly small package 2.00 x 1.25 x 0.8 mm
Color: super red (633 nm)
Viewing angle at 50 % IV: 160
Technology: InGaAlP
Optical efficiency (typ.): 7 lm/W (super red)
Assembly methods: suitable for all SMT assembly methods
Preconditioning: JEDEC Level 2 acc. to JEDEC J-STD-020D.01
Packing unit: 8 mm tape with 4000 pcs. on ∅ 180 mm reel
ESD - withstand voltage: up to 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)