HTC35D - Heat Transfer Compound 35gr

Features

Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. HTC does not contain any silicone and is therefore suitable in applications where the use of silicone in a product is prohibited. 
• Excellent thermal conductivity: 0.9W/mk
• Easy and economical to use
• Silicone-free thermal pastes
• Excellent non-creep characteristics